Insight Series
Multi-Axis X-Ray Inspection Systems
for large PCBs up to 20X24"
The Insight Multi-Axis X-Ray Inspection Systems feature outstanding configuration flexibility, six
(6) axes of motion control, unparalleled ergonomic design and a unique
no-clamp sample tray for fast load and unload. The x-ray source and
detector tilt off-axis in relation to the sample providing oblique object
viewing of PCBs up to 20-inches by 24-inches. The high-resolution
high-magnification imaging train provides crystal clear images for
inspection and failure analysis of assemblies, solder joints and near
microscopic component interlayer electrical connections. |
Related Topics 
Multi-Axis X-Ray Inspection System
The Insight is an affordable, ultra small-footprint multi-axes x-ray inspection system
with outstanding configuration flexibility, unparalleled operator-friendly ergonomic design and unique no-clamp sample tray for fast load and unload.
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Modular Design: Adaptable, upgradable and expandable (30 configurations) |
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Compact Footprint: 48”L x 52”W x 75”H |
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X-Ray Source: 75/ 90/130kV microfocus x-ray tube options |
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Magnification: >600X (based on configuration) |
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Board Handling: up to 20" x 24" | 500mm x 600mm |
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Sample Manipulation: 6-Axes sample manipulation options (X/Y, tilt, rotate, tube-Z & detector-Z motion control) |
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Unique no-clamp sample tray: Tube and detector rotate around table to provide off axis imaging |
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Image Processor options: VIP, VIPplus and VIPx (
basic to advanced SMT/BGA measurement and analysis tools)
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Insight Datasheet (Printable PDF) |
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Features Comparisons (Printable PDF) |
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Optional Image Processors |
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FSX-690 Apps Report (Printable PDF) |
60% larger board handling than similar sized systems! Applications include: failure analysis of bare boards, assemblies and parts, component interlayer prototyping, manufacturing process validation and rework verification. |
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The system is capable of handling large bare or populated PCB assemblies up to 20-inches by 24-inches or individual component packages. Off-axis inspection is accomplished by rotating the x-ray source and detector around the sample tray, hence no need for clamping of the samples.
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The high-resolution high-magnification imaging train provides crystal clear images for the analysis of virtually any board, assembly or part, including near microscopic interlayer electrical interconnection inspection of wirebond and die-attachments.
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See also Motorized Rotation Fixture |
Unique no-clamp sample tray
Controls and Indicators
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Emergency OFF switch |
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Safety Interlock Indicators |
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ESD Ground strap terminal |
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Keyed main power switch |
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X-ray on/off switch |
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X-ray: KV and mA controls |
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Camera: Focus, zoom and gain controls |
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Image Intensifier (2" or 4") |
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Z1 (Up/Down) II |
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Rotate (CW or CCW) Rotation Fixture |
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Z2 (Up/Down) Tube |
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F-Stop (Open - Close) Camera Aperture |
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Tilt (Left - Right) Tube and II |
| (1) | High-resolution 75, 90 or 130kV no-maintenance x-ray source options provide outstanding configuration flexibility.
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| (2) | The "no clamp" sample tray provides quick loading and unloading of samples. While the 6-Axes sample manipulation provides off-axis sample manipulation to reveal shape, size faults, etc. of electrical solder connections. This is especially important with double-sided boards, where top and bottom side components may obscure clear viewing of object details.
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| (3) | High-resolution 2/4 Image Intensifier with zoom lens (Magnification: >600x) provides superb imaging for viewing internal semiconductor connections such as wire-bonds, die-attach, delamination, voiding and solder joint opens. |
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| (4) | The Image Processor (Computer, Frame Grabber and VIP software); captures and displays x-ray images in real-time while providing an operator with tools to enhance, identify, analyze, measure and report — sample quality and defect characteristics.
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X-Ray Imaging Train
VIPx Image Processor Screen
See also: Image Processor Options
