| DEN-ON RD-500 Series II - Features and Benefits |
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Capable of reworking the toughest applications |
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Lead-free proven (designed for lead-free and eutectic solders) Metal shielded, ceramic, heat sink plates, plastic column BGA, µBGA, CSP and Flip-Chip packages) |
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Capable of repeatedly reworking component sizes as small as 0.5mm (0.02”) up to 60mm (2.63”) (0201, 0402, 0603, etc.) |
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Thermal advantages, designed for lead free rework applications
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Unique balanced multi-stage heating design with local bottom hot gas heater provides safe uniform heating |
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Multi-Stage hot gas heaters deliver controlled temperatures up to 950° F Infrared Bottom Heater delivers controlled temperatures up to 950° F (3x 400 Watt IR = 2,000 Watt Total) |
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Accurate time/temperature feedback and control |
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Nozzle design exceeds (industry standards) <10° between any two points Five (5) multi-channel K-type thermocouples for profiling control |
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Easy to use software requires just hours of training for proficiency |
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Easy setup and intuitive operation |
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Automated profiling, Job and component process parameters storage and recall |
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Complete (operator and automated) process data logging and file storage (business- friendly data sharing)
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Ultra clear vision based digital spit image for accurate placement / alignment |
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Provides quick and easy parts placement accurate to within (+/-0.025mm | +/- 0.00098") |
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Low air flow design eliminates the need for variable flow rate adjustments (60 Liters/minute, 1-10kgf/cm2) |
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Automated pick and place with feedback control of the part placement force
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The end user can be assured, that DEN-ON Instruments of Japan complies with all requirements and guideline laws on safety and efficacy, in accordance with TUV requirements and all applied standards. |
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The end user can be assured, that DEN-ON Instruments of Japan complies with all requirements and guideline laws on safety and efficacy, in accordance with CE requirements and all applied standards. |