Inspection and Rework Solutions for Electronics Manufacturing Inspection and Rework Solutions for Electronics Manufacturing

FocalSpot Inspection & Rework Products & Services

 

BGA/SMT Rework Stations
DEN-ON™ Semi-Automated
Rework Stations
Designed for Lead-Free Rework

 
858-536-5050
sales@focalspot.com
 


BGA/SMT Rework — Remove, Replace, Clean and Reflow solutions for eutectic and lead free solders

FocalSpot, Inc. distributes DEN-ON RD-500 Series II BGA/SMT Rework Stations in North/South America, Canada and Mexico.

The RD-500 Series II are cost effective semi-automated BGA/SMT rework stations, from DEN-ON Instruments Co., a worldwide leader of rework stations and soldering tools for over 25 years, with over 500, RD-500 systems installed worldwide.

BGA Package Removal

BGA Package Removal - Best Practices

 

 

RD-500 Series II RD-500SH Series II   SD-3000M
 
RD-500 Rework Station   RD-500SH Rework Station   SD-3000M Rework Station
     

RD-500 Series II Large Board
BGA/SMT Rework Station

RD-500SH Series II Standard Board
BGA/SMT Rework Station

SD-3000M (convection)
Spot Air SMD Removal Station

     

The RD-500 Series II Rework Station is designed for reworking medium to large PCBAs. The RD-500 incorporates a highly efficient three stage heating system that delivers 3kW overall thermal output for sufficient thermal capacity and control to execute precise profiles on medium to large PCBs up to 20x24" | 500x600 mm.

Systems ship complete with computer, Windows XP OS, LCD monitor, keyboard, mouse, frame grabber card and software.


DEN-ON Product Page - image RD-500 Product Page
DEN-ON Product Specifications - image RD-500 Specifications Page
DEN-ON Product Datasheet - image Product Data Sheet (Printable PDF)
   

The RD-500SH Rework Station is designed for reworking small to medium sized PCBAs. The RD-500SH incorporates a highly efficient three stage heating system that delivers 2.2kW overall thermal output for sufficient thermal capacity and control to execute precise profiles on small to medium PCBs up to 16x18" | 400x457mm.

Systems ship complete with computer, Windows XP OS, LCD monitor, keyboard, mouse, frame grabber card and software.


DEN-ON Product Page - image RD-500SH Product Page
DEN-ON Product Specifications - image RD-500SH Specifications Page
DEN-ON Product Datasheet - image Product Data Sheet (Printable PDF)
   

The SD-3000M Rework Station is a hot air nozzle-less system for the removal of most SMT components. The hot air nozzle traces the outside edge of a component evenly heating the soldered area. Once reflow is achieved, the nozzle lifts out of the way and the operator removes the component using the integrated vacuum tipped tool.

The SD-3000M has an adjustable motion range of up to 50x50mm and can easily remove SMT connectors and switches.


  No Nozzles Required!
   
DEN-ON Product Page - image SD-3000M Product Page
DEN-ON Product Specifications - image SD-3000M Specifications Page
DEN-ON Product Datasheet - image SD-300M Brochure (Printable PDF)
RD-500 Series II Product Features: For All NEW and Series I Systems Upgraded to V1.8.2 Software and V9.5 Firmware

3-Independent High Performance Heaters:
  Unique balanced multi-stage heating design
  Localized Hot Gas Top and Bottom Heaters
  Infrared Area Heater - prevents board warpage
  Each heater deliver up to 650°C | 1202°F
   
3-Point Cooling System:
  Produces stronger solder joints
  Delivers cool air thru Top and Bottom Local Nozzle
  Integrated Cooling Fan
   
2-Point Auto-Profiling:
  User defined rules-based (pass/fail) profile verification
  Precise time and temperature control prevents package over-temperature
   
High-Resolution (digital split image) Optics
  Provides quick and easy parts placement accurate to within (+/-0.025mm | +/- 0.00098")

 
Pre-Heat Temperature Set point:
  Profile begins at a specified board temperature
  Improves thermal profile consistency/repeatability
  NOTE: Some lead free applications require a soak temperature of 125-160°F (100-125C) prior to component placement or removal
   
Reflow before Place:
 

Heats solder paste to reflow prior to placement

  Manual control to place a part once solder/paste has reflowed
  Facilitates optimal placement of SMT leaded devices
   
Cleaning Mode:
 

Lifts the heater head, but continues bottom heat for site cleaning

     
Heater Setting Upgrade:
  Increased heater capacity/setting to 650°C
  NOTE: Required for some specialized lead free applications
  DEN-ON Upgrade Datasheet - image See DEN-ON Service/Upgrades PDF for upgrade details
   
FocalSpot, Inc. is the distributor for DEN-ON lead-free PCB rework solutions in North/South America, Canada and Mexico.

 

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