DEN-ON™ Rework Stations
Semi-Automated, Hot Air+IR
Ball Grid Array (BGA)
QFN | SMT | SMD
Rework Stations
for Eutectic & RoHS Lead-Free Solders
| BGA|QFN|SMT|SMD Rework Solutions: Remove, Replace, Clean and Reflow (eutectic and RoHS lead-free solders) |
 DEN-ON Instruments, LTD.The RD-500 Series are affordable semi-automated BGA/SMT rework stations from DEN-ON Instruments Co., a worldwide leader of rework stations and soldering tools for over 25 years, with over 500, RD-500 systems installed worldwide. |
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FocalSpot, Inc. distributes DEN-ON RD-500 Series BGA/SMT Rework Stations in North/South America, Canada and Mexico.
Sales, Support and Service Locations |
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United States |
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South America/Canada & Mexico |
RD-500 Large Board
BGA/SMT Rework Station
RD-500SH Standard Board
BGA/SMT Rework Station
SD-3000 II (convection)
Spot Air SMD Removal Station
The RD-500 Rework Station is designed for reworking medium to large PCBAs. The RD-500 incorporates a highly efficient three stage heating system that delivers 3kW overall thermal output for sufficient thermal capacity and control to execute precise profiles on medium to large PCBs up to 20x24" | 500x600 mm. Each system comes complete with an Internal Flash Memory Hard Drive control system, no hard drive or separate computer necessary. |
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RD-500 Product Page |
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RD-500 Specifications Page |
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Product Data Sheet (Printable PDF) |
The RD-500SH Rework Station is designed for reworking small to medium sized PCBAs. The RD-500SH incorporates a highly efficient three stage heating system that delivers 2.2kW overall thermal output for sufficient thermal capacity and control to execute precise profiles on small to medium PCBs up to 16x18" | 400x457mm. Each system comes complete with an Internal Flash Memory Hard Drive control system, no hard drive or separate computer necessary. |
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RD-500SH Product Page |
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RD-500SH Specifications Page |
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Product Data Sheet (Printable PDF) |
The SD-3000 II Rework Station is a hot air nozzle-less system for the removal of most SMT components. The hot air nozzle traces the outside edge of a component evenly heating the soldered area. Once reflow is achieved, the nozzle lifts out of the way and the operator removes the component using the integrated vacuum tipped tool. The SD-3000 II has an adjustable motion range of up to 50x50mm and can easily remove SMT connectors and switches. |
| No Nozzles Required! | |
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SD-3000 II Product Page |
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SD-3000 II Specifications Page |
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SD-300M Brochure (Printable PDF) |
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