Verifier Plus (FSX-075)
Enhanced-Resolution
X-Ray Inspection System
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Related Topics 
Verifier Plus (FSX-075)
Enhanced X-Ray Inspection System
The Verifier Plus is a low-cost, general purpose solder quality verification and defect detection tool designed for fast and intuitive BGA/SMT solder quality inspection applications. The Verifier Plus provides continuous real-time x-ray solder quality, failure analysis and rework verification.
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75kV, 33 micron microfocus no-maintenance x-ray source, provides sufficent power to inspect BGA/SMT components and low-desity materials.
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Sample handling: up to 16 x 18" (406 x 457mm) |
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Small footprint of 32 x 34" | 813 x 864mm easily rolled to where ever needed (i.e., production floor, prototype lab, rework area, etc.)
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Greater than >200X magnification provides excellent viewing of the smallest SMD electrical interconnections.
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Systems are CE, CSA and TUV certified and exceed all safety and radiation protection requirements set forth by CDRH and FDA regulations. |
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Verifier Plus Datasheet (Printable PDF) |
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FSX-075 Apps Report (Printable PDF) |
| Optional Image Processors |
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The standard sample manipulator has five angled set points, to provide angulations up to 30° or more depending on board size.
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Angular viewing provides improved detection of opens, non-wetting and void position.
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See also Rotation Fixtures |
Controls and Indicators
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Failure analysis |
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Process validation |
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Semiconductor prototyping |
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Bare board registration |
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Rework verification |
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Emergency OFF switch |
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Safety Interlock Indicators |
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ESD Ground strap terminal |
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Keyed main power switch |
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X-ray on/off switch |
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X-ray: KV and mA controls |
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Camera: 2/4" I.I., zoom and gain controls |
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Assessment of reflow thermal profile results |
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Uniformity of solder shape lead to board pad |
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Effect on devices in proximity of the rework operation |
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Device and package placement / positioning |
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and more... |
| (1) | High-resolution 75kV, 33micron no-maintenance microfocus x-y source provides continuous real-time inspection with a
large (70mm) field-of-view (FOV) to quickly inspect solder quality of assemblies or rework operations.
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| (2) | Sample Manipulator (Board Holder): Positions the sample in the x-ray path. Provides off axis positioning (tilt /rotate) of the sample between the source and detector.
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| (3) | High-resolution 2/4" image detector with zoom lens provides >200X magnification for detailed viewing of the smallest SMD electrical interconnections. While the large field-of-view can display (70mm) packages in a single view for rapid identification of bridges, missing, poor shape and large voids. |
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| (4) | Camera (lens optics and CCD Sensor): Converts analog light waves into digital video signals |
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| (5) | The Image Processor (Computer, Frame Grabber
and VIP software); captures and displays x-ray images
in real-time while providing an operator with tools
to enhance, identify, analyze, measure and report — sample quality and defect characteristics.
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X-Ray Imaging Train
