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Verifier Series |
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The Verifier Series (FSX-75/80/90) are mobile
x-ray systems with exceptional performance
and value. Ideal for
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| Ten (10) X-Ray Purchase Considerations | |
| Features Comparison Table | |
| Verifier Series Product Overview Video |
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Placeholder
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Other Uses for X-Ray Inspection |
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| Semiconductor: Prototyping, failure analysis and manufacturing process validation. | |
| Semiconductor Apps Datasheet | |
| Counterfeit Device Screening: Nondestructive electronic device screening to determine authenticity and quality of manufacture. | |
| Counterfeit Device Screening - X-Ray | |


The Verifier (FSX-080) is an entry-level fundamental solder quality verification and defect detection tool (QuickCheck™). Designed for fast and intuitive BGA/SMT solder quality inspection applications.
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| Verifier Product Page | |
| Verifier Specifications Page | |
| Verifier Datasheet (Printable PDF) | |
| Features Comparisons (Printable PDF) | |
| FSX-080 Apps Report (Printable PDF) | |
The Verifier Plus (FSX-075) is a low-cost, general purpose solder quality verification and defect detection tool. Designed for fast and intuitive BGA/SMT solder quality inspection applications.
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| Verifier Plus Product Page | |
| Verifier Plus Specifications Page | |
| Verifier Plus Datasheet (Printable PDF) | |
| Features Comparisons (Printable PDF) | |
| FSX-075 Apps Report (Printable PDF) | |
The Verifier HR (FSX-090) is an affordable high-resolution and high-magnification x-ray system designed for virtually any quality inspection and defect detection application.
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Verifier Series SMT Inspection Features Comparison Table |
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System Features |
Verifier |
Verifier |
Verifier 90 |
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X-Ray Source |
80kV |
75kV |
90kV |
Magnification |
>100X |
>200X |
>650X |
Spot Size |
50 micron |
33 micron |
5 micron |
Resolution
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>20 lp/mm
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>30 lp/mm
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>40 lp/mm
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Field-of-View (max.)
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>70mm |
>70mm |
>40mm |
Inspection Capabilities |
Verifier |
Verifier |
Verifier 90 |
Measurement Reporting
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Solder Joint Quality (BGA, Leaded)
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Bridging
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Voiding
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Opens
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Bare boards (Inner layers, traces, vias)
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Component Package Inspection (wire bonds)
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Subtle Defect Inspection
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Flip Chip Capable
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| Features Comparison Table (Printable PDF) | |||
Affordable: "Best in Class" Performance, Portable X-Ray Inspection Solution. |
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Easy to Use: No complexity / No intimidation / No programming / No fixturing required, train operators quickly and easily |
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Safe: Exceeds all safety and radiation protection requirements set forth by CDRH and FDA regulations. |
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Reliable: Low maintenance, no motors or limit switches to replace. |
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Portable: Able to fit through a standard door and hallways, on casters and easily rolled wherever needed |
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Failure analysis |
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Manufacturing process validation
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Prototyping and design inspection |
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Bare board inspection
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Rework verification |
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